TECHNICAL PROGRAM COMMITTEE

17th Annual Topical Meeting on Electrical Performance of Electronic Packaging

Meeting Co-Chairs

Michael Lamson, Texas Instruments, rtd
Andreas Weisshaar, Oregon State University

Members

Jerry Aquirre, Kyocera
Dale Becker, IBM
Falvio Canavero, Politecnico di Torino
Hartmut Grabinski, University of Hannover
Robert Jackson, University of Massachusetts
Michael Lamson, Texas Instruments
Michel Nakhla, Carlton University
Dean Neikirk, University of Texas
Albert Ruehli, IBM
Jose Schutt-Aine, University of Illinois
Madhavan Swaminathan, Georgia Institute of Technology
Paul Franzon, North Carolina State University

Thomas Winkel, IBM
Chuck Yuan, Rambus

Kathleen Melde, University of Arizona
Vikram Jandalaya, University of Washington
Brian Young, Texas Instruments