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18th Conference on Electrical Performance of Electronic Packaging and Systems EPEP 2009 October 19-21, 2009 Portland, Oregon Sponsors The IEEE Components, Packaging and Manufacturing Technology Society IEEE Microwave Theory and Techniques Society Call for Papers The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. The goal of the meeting is to be the leading conference dealing with advanced and emerging issues in electrical design of interconnect structures and assurance of Signal Integrity. Authors are invited to submit papers describing new technical contributions in the areas broadly covered below: · Current and future issues related to system level and on-chip interconnections · Electrical design, modeling and analysis techniques applicable to ensuring the Signal Integrity of interconnect structures · Electrical design, modeling and analysis techniques applicable to ensuring the integrity of power and ground delivery at the system and chip levels · Design of high speed links, including jitter and noise management · New and innovative interconnect packaging structures and their electrical performance · Measurement and data analysis techniques for system level and on-chip structures · Signal integrity in mixed signal and RF integrated circuits and modules · RF/microwave packaging structures and their electrical performance · Electromagnetic modeling and simulation tools and flows · Macromodeling and model reduction as it applies to electrical analysis · Advances in transmission-line techniques Conference Co-chairs: Andreas Weisshaar, National Science Foundation and Dale Becker, IBM Conference Web Page: Detailed information can be found at http://www.epep.org Paper Submission: Information for authors can be found on the conference web page. Electronic submissions of no more than four pages must be received no later than July 18, 2009. Papers should be compliant with the general standards of the IEEE, including inclusion of appropriate references. Student Paper Award: Two awards may be presented to the best two papers submitted by students. Letter from advisor is required to enter (see web site). Short
Courses/Workshops: On Sunday, October 18, a workshop entitled
"Future Directions in Packaging" will be presented and short
courses/tutorials may be offered. For more information please see the web site at: http://www.epep.org or contact: Andreas Weisshaar, email:
andreas@eecs.oregonstate.edu
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