Final Program

Future Directions in IC and Package Design Workshop (FDIP)

October 26, 2008, San Jose, CA

sponsored by:

organized by:

CPMT Technical Committee on Electrical Design, Modeling, and Simulation (TC-EDMS) 

1:15pm  - 1:30 pm       Welcome Remarks,  Alina Deutsch, IBM

                                                                            Madhavan Swaminathan, GIT

SESSION I: SYSTEM DESIGN

1:30pm – 4:30 pm

Session Chair: Paul D. Franzon, – North Carolina State University

      1:30pm – 2:05pm   Architecture Implications of 3D Integration Technology   –                                  Michael Ignatowski, IBM Corporation

        2:05pm – 2:40pm   Design Considerations for Highly Integrated 3D SiP for Mobile

                                  Applications – Joungho Kim, KAIST Korea

        2:40pm – 3:15pm  Design of Through-Silicon Vias and Vertical Shielding for 3D

                                  Integration - Ivan Ndip, Fraunhofer Institute for Reliability &

                                         Microintegration, IZM, Germany

        3:15pm – 3:50pm   Tb/s-Class Module-to-Module Optical Data Buses on

                                  Printed-Circuit Boards  -  Fuad Doany, IBM Corporation

3:50   – 4:30 pm - Refreshment Break

SESSION II: MODELING

4:30pm – 6:25 pm

Session Chair: Albert E. Ruehli, IBM Corporation

        4:30pm – 5:05pm   Electromagnetic Solvers for Interconnect and Package

                                  Modeling – New Developments – Sadasiva M. Rao, Auburn 

                                  University

        5:05pm – 5:40pm  Accelerated Parallelized Integral Equation Techniques for

                                 Packaged Microelectronics – Vikram Jandhyala, University of

                                 Washington

        5:40pm – 6:15pm  Benefits of Surface Integral Equation Modeling Leveraging

                                 Massively Parallel Advanced  Techniques – Jason D. Morsey,

                                IBM Corporation

6:15pm – 6:25 pm   Closing Remarks, Madhavan Swaminathan, GIT,

                           Alina Deutsch, IBM

Presentations will be posted on the IEEE CPMT Society web page at:

http://www.ewh.ieee.org/soc/cpmt/tc12/

Workshop Chairs:

Alina Deutsch                Madhavan Swaminathan

IBM Watson Research Center   Georgia Institute of Technology

 Technical Program Committee:

Tawfik Arabi – Intel Oregon                     Mahadevan Iyer - IME, Singapore

Andreas Cangellaris - U of Illinois             George Katopis - IBM Poughkeepsie      

Moises Cases - IBM Austin                          Istvan Novak - SUN

Chi-Shih Chang – Consultant                        Toshio Sudo - Toshiba, Japan

Paul Franzon - North Carolina State U               Gregory Taylor - Intel Oregon

Hartmut Grabinski - U of Hanover, Germany     Lewis Terman – IBM Watson Research   

Brian Young – Texas Instruments

Workshop will be held at the Wyndham Hotel, 1350 N. 1st Street, San Jose, California 95112, (408) 453-6200.  The hotel is holding a block of rooms for participants at a special rate of $119.00 plus tax.  Room reservations must be made by September 25, 2008 to guarantee this rate.  After that time rooms will be on a space and rate available basis only.  Be sure to mention that you are attending the Electrical Performance of Electronic Packaging conference. Rooms are limited so make your reservations early.  Additional information can be obtained at www.epep.org

Additional information may be obtained from the workshop chairs:

Alina Deutsch                                                 Madhavan Swaminathan

deutsch@ieee.org                           madhavan.swaminathan@ece.gatech.edu

phone: (914) 945-2858                                     phone: (404) 894-3340

fax:      (914) 945-2141                                    fax:      (404) 894-9959

and the workshop administration:

epd@engr.arizona.edu

phone: (520) 621-3054

 fax:      (520) 621-1443

 Attendees interested in the workshop will be charged a $60.00 fee that will cover afternoon refreshments, digest of abstracts, and posting of the foils on the CPMT Society TC-EDMS web site. All attendees must register by September 12, 2008 using the EPEP’08 website at www.epep.org in order to assure that the workshop is being held. On-site registrants will be admitted depending on availability of seating.